Server Liquid Cooling Module FAQs
Clear answers on architecture, compatibility, customization, performance references and the information needed to start a project.
What is a closed-loop server liquid cooling module?
A closed-loop server liquid cooling module combines a processor cold plate, pump, coolant tubing, radiator and fans in a sealed internal loop. The cold plate moves heat from the processor into the coolant, while the radiator transfers that heat back to the server airflow. The documented configurations do not require a rack CDU or facility water connection.
How is it different from open-loop direct-to-chip cooling?
Both architectures use a cold plate on the processor. In a closed-loop module, the pump and air-cooled radiator are part of the server assembly. An open-loop direct-to-chip system connects server cold plates to rack manifolds and a CDU. The right choice depends on rack density, facility readiness and how much heat must be removed by liquid.
Does ThermalBro offer 1U, 2U and 4U configurations?
Yes. The documented product family includes 1U, 2U and 4U reference configurations for selected AMD and Intel platforms. Rack height is only the starting point; we also review the board layout, processor socket, radiator space, airflow, tubing route and service access before confirming a model.
Can ThermalBro customize the cold plate, tubing and radiator?
Yes. We can review the processor interface, mounting structure, tubing direction, radiator size, fan arrangement and available chassis space as one module. Customization starts with your board and chassis files, heat load, operating conditions and expected quantity.
What does a documented 300 W, 500 W or 600 W value mean?
It is a configuration reference from the product deck, not an unconditional thermal guarantee. Final capacity depends on the heat source, ambient temperature, airflow, coolant, pump operating point, radiator installation and acceptance temperature. We confirm the project test method and limits before release.
How does ThermalBro control leakage risk?
We leak-test liquid cooling modules before shipment. Test pressure, duration, medium and acceptance limits are defined for the applicable product. Additional pressure or reliability tests are agreed according to the operating conditions.
What information is needed for a custom server cooling project?
Start with the processor and socket, board revision, chassis CAD or available space, expected heat load, ambient and airflow conditions, radiator location, tubing route, service requirements, prototype quantity and production forecast. If some information is missing, ThermalBro can identify the gaps during the first review.
Can the same module be used for every motherboard with the same socket?
Not automatically. The socket may be the same while mounting keep-outs, memory and VRM positions, radiator space, airflow and service access differ. We verify the exact board and chassis revision before confirming compatibility.
