Board-Level Heat Collection
The contact interface, cold plate and mounting are developed around the heat sources and mechanical limits of the exact platform.
Board-specific liquid cooling
Custom CPU & GPU Liquid Cooling Modules
We design and manufacture CPU and GPU liquid cooling modules for your exact processor and board layout. Our engineers review heat sources, mounting space and coolant connections, then develop the agreed design for prototyping and production.
The models below are GPU module examples. For a custom CPU module, send the processor, socket, board and cooling-loop requirements.
Product definition
What a CPU or GPU Liquid Cooling Module Does
A CPU or GPU liquid cooling module is a platform-specific cold-plate assembly that moves heat from selected processor or board components into a circulating coolant loop. Compatibility depends on the exact processor or PCB revision, component heights, contact areas, mounting and operating conditions.
The module is one part of the complete thermal system. The pump, heat exchanger, coolant and system controls must be defined as part of the project unless they are explicitly included in the agreed scope.
Connection to the External Cooling Loop
Connector direction, tubing, coolant and operating range are reviewed together with the pump and heat-rejection equipment used by the system.
GPU Liquid Cooling Module Examples
Compare the 4090 and 5090 module examples below. We confirm contact areas, mounting and connections against your exact graphics card or PCB revision before recommending a configuration.
EWBN49T01 GPU Liquid Cooling Module
A documented liquid cooling module reference for 4090 projects, using UQD02 quick connectors, PTFE corrugated tubing and friction stir welding.
Swipe horizontally to review the product views and parameters.
| Model | GPU Reference | Product Size | Connection | Tubing | Joining Process | TDP Reference |
|---|---|---|---|---|---|---|
| EWBN49T01 | 4090 | 286.7 × 98.2 × 16.7 mm | UQD02 quick connector | PTFE corrugated tube | Friction stir welding | 500 W |
The TDP value is a documented model reference, not an unconditional cooling guarantee for another board or loop. Final performance must be confirmed under the agreed coolant, flow, inlet-temperature, load and test conditions.
EWBN59T01 GPU Liquid Cooling Module
A documented liquid cooling module reference for 5090 projects, using UQD02 quick connectors, PTFE corrugated tubing and friction stir welding.
Swipe horizontally to review the product views and parameters.
| Model | GPU Reference | Product Size | Connection | Tubing | Joining Process | TDP Reference |
|---|---|---|---|---|---|---|
| EWBN59T01 | 5090 | 291.3 × 125 × 16.9 mm | UQD02 quick connector | PTFE corrugated tube | Friction stir welding | 600 W |
The TDP value is a documented model reference, not an unconditional cooling guarantee for another board or loop. Final performance must be confirmed under the agreed coolant, flow, inlet-temperature, load and test conditions.
Compatibility inputs
Why the Exact Board and Processor Platform Matter
A CPU or GPU name is only the starting point. Board revisions can change component locations, heights, mounting points, connector clearances and available space for fittings and tubes. We use the exact platform information to decide what should make contact, what must remain clear and how the module can be installed and serviced.
- Exact processor, socket, graphics card or PCB revision
- 2D/3D files and board/component-height information
- Heat-source and required-contact map
- Mounting points, keep-outs, interface stack and board-loading limits
- Workload or power cases and target operating conditions
- Coolant, inlet temperature, expected flow/pressure range and external-loop information
- Connector direction, tube route, enclosure space and multi-card spacing
- Project stage, expected quantity and target schedule for review
Custom Engineering Around Your Board and Cooling Loop
A workable module has to fit more than the processor. Contact areas, component heights, mounting, board deflection, fittings, tube routing and service access all affect the design. Our engineering review brings these thermal, mechanical and fluid requirements together before tooling or production decisions are made.
Thermal and Contact Requirements
We review which heat sources require contact, the interface stack, board-loading limits and the operating cases the approved design needs to answer.
Mechanical Packaging and Service Access
The module envelope, mounting, keep-outs, fittings and installation motion are checked against the board, enclosure and service route.
Fluid Connections and Loop Conditions
Connector selection, tube direction, coolant and expected flow and pressure range are reviewed with the external loop rather than in isolation.
Professional Workstations
Board-specific modules for rendering, engineering and creative workstations where fit, acoustics and service access all matter.
Explore workstation modules →
GPU Compute and Local AI
Custom module reviews for GPU compute, local AI development and multi-card enclosures with limited space around the boards.
Review required platform inputs →
Server-Class Accelerators
Rack and server accelerator projects need a server-specific review of chassis height, airflow, routing and system architecture.
Explore server cooling modules →From Custom Cold Plate Design to Repeatable Module Production
ThermalBro combines liquid-cooling design support with CNC machining, cold-plate production, joining, assembly and inspection capabilities. Keeping these steps in one manufacturing route helps the team respond when a board revision changes and carry an approved module into small-batch or repeat production.
Testing a Liquid Cooling Module Before Production
We agree a test plan for the module and its operating conditions. Checks may cover mechanical fit, sealing, pressure, cooling performance and aging or temperature exposure.
01Fit and Assembly Checks
Confirm contact, mounting, clearances, tube routing and service motion on the identified platform.
02Leak and Pressure Checks
Verify the assembled coolant path against the pressure, duration and acceptance criteria agreed for the project.
03Thermal Performance
Test the approved configuration under defined coolant, flow, load, environment and measurement conditions.
04Aging and Temperature Checks
Apply project-specific aging or high/low-temperature checks when they are part of the agreed validation plan.
Test conditions matter. Coolant, inlet temperature, flow, load, environment, measurement points, method and acceptance criteria should be recorded whenever a thermal or fluid result is used to release a design.
How a Custom CPU or GPU Cooling Project Moves Forward
We review your platform, develop the contact and installation details, build a prototype and test it against the agreed requirements before preparing for production.
01 / INPUTShare the Platform
Send the exact board or processor information, files, heat sources and project context.
02 / REVIEWReview Requirements
We confirm the contact areas, mounting, keep-outs, envelope and loop conditions.
03 / DESIGNDevelop the Module
Thermal, mechanical and fluid details are brought into one design direction.
04 / PROTOTYPEBuild the Prototype
We manufacture and assemble the identified version agreed for evaluation. Review prototyping.
05 / VALIDATEAnswer the Project Questions
Confirm fit and the agreed leak, pressure, thermal or environmental checks. Review testing.
06 / PRODUCTIONPrepare Repeat Production
Retain the approved configuration and review later platform or component changes before use. Review manufacturing.
CPU & GPU Liquid Cooling Module FAQs
Clear answers on board compatibility, CPU customization, TDP references, cooling coverage, external-loop scope and the information required before prototyping.
What is a CPU or GPU liquid cooling module?
A CPU or GPU liquid cooling module is a platform-specific cold-plate assembly that transfers heat from selected processor or board components into a circulating coolant loop. The exact processor or PCB revision, contact map, mounting and loop conditions determine compatibility.
Are the published GPU module references compatible with every card using the same GPU name?
No. Cards using the same GPU can have different PCB layouts, component heights and mounting points. Send the exact card model or PCB revision so we can confirm fit.
What does a documented thermal or TDP reference mean?
It is the model-level reference stated in the ThermalBro product documentation. It should not be treated as an unconditional cooling guarantee for another board or loop unless the coolant, flow, inlet temperature, load, environment, measurement method and acceptance criteria are also confirmed.
Can ThermalBro develop a custom CPU liquid cooling module?
Yes. We review custom CPU modules using the processor, socket, board layout, mounting space and cooling-loop requirements. The product examples shown on this page are GPU modules.
Does the module cool memory and power components as well as the processor or GPU?
Coverage depends on the exact board, component heights, thermal targets, interface stack and board-loading limits. ThermalBro confirms the required contact map during the platform review rather than assuming the same coverage for every board.
Does a module include the pump and heat exchanger?
Not unless those items are explicitly included in the agreed project scope. Treat the module as part of the external cooling loop and confirm the pump, heat rejection, coolant and controls at system level.
What information should we send for a custom module?
Send the exact processor, graphics card or PCB revision, 2D/3D files, component-height and heat-source data, required contact areas, mounting and keep-outs, workload or power cases, coolant and loop conditions, connector and tube direction, enclosure or multi-card spacing, project stage and expected quantity.
What should be tested before production?
The test plan should match the approved product version and operating conditions. Depending on the project, it may include fit and contact checks, leak or pressure tests, pressure-drop and flow behavior, thermal performance, aging or temperature checks and service movement of the connections.
Tell Us Which CPU or GPU Platform You Need to Cool
Share the processor or board revision, available drawings, heat sources and cooling-loop conditions. We will review the design requirements and next steps for a prototype.