Processor Heat Collection
A platform-specific all-copper skived cold plate and mounting route transfer heat from the processor into the internal coolant loop.
OEM Workstation Cooling
OEM WorkstationLiquid Cooling Modulesfor High-Power CPUs
We design and manufacture workstation liquid cooling modules for your CPU, motherboard, chassis and sustained workload. Compare the AMD and Intel examples below, then work with us to confirm mounting, tube routing, controls and testing.
Product Definition
What a Workstation Liquid Cooling Module Includes
A workstation liquid cooling module is an integrated cooling assembly built around a professional CPU platform. The documented route combines a platform-specific cold plate and mounting hardware with tubing, a pump, a radiator and PWM fans so heat can move from the processor into the coolant and then to the surrounding air.
The module is installed inside an OEM or system-integrator workstation. It is not a complete workstation and does not define the final motherboard, processor, GPU, memory, storage, power supply or operating system.
Coolant Circulation and Heat Rejection
The pump moves coolant through the tubing and radiator; PWM fans then reject heat into the workstation airflow.
Explore Our Workstation Liquid Cooling Module Range
Compare the AMD and Intel module examples below. We confirm the exact processor, socket hardware, motherboard and chassis before selecting a configuration.
AMD platform note: EPYC 8004 processors use Socket SP6. For module entries listing both EPYC 8004 and 9004, specify the exact processor, socket and mounting kit when confirming the configuration. A grouped module reference does not mean the processors share a socket. See the AMD EPYC 8004 architecture overview (Publication 58268, Rev. 1.1, May 2024).
AMD Workstation Liquid Cooling Modules
AMD module examples include 240-class and 360-class radiator configurations. Send the exact processor model, socket and motherboard revision so we can confirm the mounting and cooling requirements.
Swipe horizontally to review product views and parameters.
| Model | Processor / Socket Reference | TDP Reference | Radiator Envelope | Fans |
|---|---|---|---|---|
| DWA24012CUA1001R | AMD SP3/6 · EPYC 7002/7003 and Ryzen Threadripper series | 400 W | 278 × 55 × 120 mm | 2 × 120 mm |
| DWA36012CUA1001R | AMD SP3/6 · EPYC 7002/7003 and Ryzen Threadripper series | 600 W | 396 × 55 × 120 mm | 3 × 120 mm |
| DWA24012CUA2001R | AMD SP5 · EPYC 8004/9004 series | 400 W | 278 × 55 × 120 mm | 2 × 120 mm |
| DWA36012CUA2001R | AMD SP5 · EPYC 8004/9004 series | 600 W | 396 × 55 × 120 mm | 3 × 120 mm |
Documented TDP and dimensional values are model-selection references, not an unconditional performance or compatibility guarantee. Final results depend on the released board, chassis, workload, ambient, airflow, control and test conditions.
Intel Workstation Liquid Cooling Modules
Intel module examples cover selected Xeon workstation platforms. Send the exact processor, socket and motherboard revision to confirm the appropriate mounting hardware and module configuration.
Swipe horizontally to review product views and parameters.
| Model | Processor / Socket Reference | TDP Reference | Radiator Envelope | Fans |
|---|---|---|---|---|
| DWA24012CUI1001R | Intel LGA4189 · third-generation Xeon series | 300 W | 278 × 55 × 120 mm | 2 × 120 mm |
| DWA36012CUI1001R | Intel LGA4189 · third-generation Xeon series | 400 W | 396 × 55 × 120 mm | 3 × 120 mm |
| DWA24012CUI2001R | Intel LGA4677/4710 · fourth-, fifth- and sixth-generation Xeon series | 400 W | 278 × 55 × 120 mm | 2 × 120 mm |
| DWA36012CUI2001R | Intel LGA4677/4710 · fourth-, fifth- and sixth-generation Xeon series | 600 W | 396 × 55 × 120 mm | 3 × 120 mm |
| DWA24012CUI3001R | Intel LGA7529 · sixth-generation Xeon series | 400 W | 278 × 55 × 120 mm | 2 × 120 mm |
| DWA36012CUI3001R | Intel LGA7529 · sixth-generation Xeon series | 600 W | 396 × 55 × 120 mm | 3 × 120 mm |
Documented TDP and dimensional values are model-selection references, not an unconditional performance or compatibility guarantee. Final results depend on the released board, chassis, workload, ambient, airflow, control and test conditions.
Selection and Workload
Match the Module to Your Workstation
Radiator size is only one part of workstation cooling. Sustained processor load, ambient temperature, chassis airflow resistance, available radiator space, fan and pump control, acoustic targets and service access all affect the right route.
We review the board, mounting, radiator space and service access together so the module can be tested in the workstation you plan to build.
| Decision Factor | Traditional Air Cooler | Standard Consumer AIO | OEM Workstation Module | What to Confirm |
|---|---|---|---|---|
| Professional platform fit | Platform-dependent | Listed sockets only | Board and mounting review | Released board and socket hardware |
| Contact and mounting | Product-defined geometry | Product-defined geometry | Project-specific review | Contact, load and keep-outs |
| Radiator and routing | Not applicable | Standard package | Chassis-integrated route | Space, orientation and service path |
| Validation | Integrator-defined | Supplier product scope | Project-defined checks | Conditions and acceptance criteria |
Rendering and Virtual Production
Long render queues need evaluation under sustained, not momentary, CPU load.
CAD, CAE and Simulation
Engineering workloads combine long CPU runs with chassis and acoustic limits.
Local AI and Data Science
CPU cooling must be coordinated with GPU heat and radiator space.
Scientific Computing
Repeatable thermal conditions matter when jobs run for hours.
We Adapt the Cold Plate, Mounting and Routing to Your Workstation
The processor name is only the starting point. Contact geometry, mounting load, motherboard keep-outs, radiator location, tube direction, controls, installation space and service access all affect the module.
01Cold-plate contact area and platform-specific mounting02Bracket, fastener and allowable loading review03Tube length, direction and service movement04Radiator location and complete module envelope05Pump and fan power or control interface06Appearance, labels and assembly requirements where supported
Each item remains subject to the released board, chassis and engineering review. A platform name alone is not enough to confirm fit.
Send the Platform Information You Already Have
- Exact CPU and motherboard revision
- Socket hardware and mounting information
- Chassis 2D/3D and radiator space
- Sustained workload or power cases
- Ambient, airflow and acoustic targets
- Tube route and service access
- Power and control requirements
- Project stage and expected quantity
From Cold Plate Machining to Workstation Module Assembly
ThermalBro combines engineering support with CNC machining, cold-plate production, joining, module assembly and inspection. One manufacturing route reduces handoffs when a board, mounting detail or tube route changes.
How We Test Workstation Liquid Cooling Modules
The validation plan separates fit, leak or pressure, thermal performance and environmental checks so each result answers a clear project question for the configuration that will be evaluated or shipped.
01Fit and Assembly
Confirm contact, mounting, clearances, tube routing and service motion.
02Leak and Pressure Checks
Verify the coolant path against agreed conditions and acceptance criteria.
03Thermal and Environmental Checks
Test the released route under defined load, coolant, ambient, airflow and control conditions.
04Configuration and Final Inspection
Keep identification, assembly details and final checks tied to the approved version.
The product version, coolant, ambient, airflow, load, measurement points, method and acceptance criteria should be recorded whenever a thermal or fluid result is used for a decision.
From Workstation Platform Review to Repeat Production
We review your workstation requirements, develop the module, build a prototype and test the agreed configuration before preparing for repeat production.
01 / INPUTShare the Platform
Send the CPU, motherboard, chassis, workload and project context.
02 / REVIEWReview the Cooling Route
Confirm contact, mounting, radiator space, routing and controls.
03 / DESIGNDevelop the Module
Coordinate thermal, mechanical and fluid requirements.
04 / PROTOTYPEBuild the Prototype
Manufacture and assemble the agreed evaluation version.
05 / VALIDATEAnswer the Project Questions
Test fit and the approved leak, pressure, thermal or environmental scope.
06 / PRODUCTIONPrepare Repeat Production
Retain the approved configuration and review later changes.
Workstation Liquid Cooling Module FAQs
Clear answers on module scope, published platform references, customization, 240- and 360-class selection, acoustics, leakage testing and the inputs needed before prototyping.
What is included in a workstation liquid cooling module?
The documented route combines a platform-specific cold plate and mounting hardware with tubing, a pump, a radiator and PWM fans. It is a cooling module for integration into a workstation, not a complete workstation or a definition of the final compute hardware.
Which CPU platforms do the published modules cover?
The tables show AMD and Intel module examples. Compatibility must be confirmed using the exact processor, socket, motherboard and mounting hardware, together with chassis space and the intended workload.
Can ThermalBro customize the mounting hardware and tube routing?
Mounting, cold-plate contact, tube length or direction, radiator placement and control requirements can be reviewed against the target board and chassis. Please send the available board and enclosure information before compatibility is confirmed.
How should we choose between a 240 mm and 360 mm route?
The decision depends on sustained CPU load, ambient temperature, chassis airflow resistance, radiator space, fan and pump control, acoustic targets and service access. TDP alone is not enough to select the released workstation configuration.
Does liquid cooling always make a workstation quieter?
No. Noise depends on the complete workstation, including the radiator fans, pump, GPU, storage, power supply and chassis airflow. An acoustic target must be evaluated under a defined workload and measurement condition.
How are workstation liquid cooling modules checked for leaks?
We leak-test liquid cooling modules before shipment using the requirements defined for the applicable product. Pressure, duration, medium and acceptance criteria are confirmed for the module; additional validation depends on the project.
What information is required for an OEM workstation cooling project?
Send the exact CPU and motherboard revision, socket and mounting information, chassis files, sustained workload, ambient and airflow conditions, radiator space, tube route, control requirements, service access, project stage and expected quantity.
Can ThermalBro support prototypes and repeat production?
ThermalBro supports custom design, prototyping, testing and production-oriented manufacturing. Project timing, quantity and validation scope are confirmed after the platform files, materials and required tests have been reviewed.
Tell Us What Your Workstation Needs to Cool
Share the CPU, motherboard, chassis, sustained workload and radiator space you already know. We will review a suitable module configuration and the next steps for prototyping.